Boron Nitride Plates/Trays [MH-BNC995T - BoronNitride]

Product Features

Introducing our high-performance Boron Nitride (BN) Products, designed for high-temperature applications and exceptional durability:

• High Purity and Density: Featuring >99.5% BN purity and a density of 1.95±0.05 g/cm³, ensuring superior performance in extreme conditions.
• Exceptional Thermal Properties: With a maximum operating temperature of 850°C in air and >2000°C in inert atmospheres, the material is perfect for high-temperature applications.
• Superior Mechanical Strength: The flexural strength of 22 MPa and hardness of 4 kg/mm² ensure that these products maintain structural integrity under stress.
• No Binder Additives: Our process excludes the use of binders, ensuring the stability and purity of the final product.

Applications

Boron Nitride products are ideal for:

• High-Purity Crucibles: Suitable for molten metal handling in extreme temperature environments.
• Crucible and Bearing Plates: Designed for the sintering of nitride phosphors, silicon nitride, aluminum nitride, and other ceramics and powders.
• High-Temperature Furnace Components: Including electrode insulation parts and protective tubes for use in extreme thermal conditions.
• Boron Nitride Insulation: Used in polysilicon ingot furnaces for insulation assemblies.

Technical Highlights

• Cold Isostatic Pressing and Hot Pressing Sintering: Utilizes advanced two-way pressure sintering technology to create highly dense and durable materials.
• Low Thermal Expansion: Coefficient of thermal expansion is controlled between -1 to 1.2 (10⁻⁶/K), ensuring dimensional stability in temperature variations.
• High Thermal Conductivity: With thermal conductivity ranging from 50-70 W/mK, these products efficiently manage heat, ensuring consistent performance in high-temperature environments.

Technical Specifications

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