Silicon Nitride bonded Silicon Carbide Plate [MM-XG-SiC75]
Product Features
Introducing our high-performance Silicon Nitride Bonded Silicon Carbide (Si₃N₄-SiC) plates, specially designed to deliver excellent thermal and mechanical performance:
- Exceptional Thermal Shock Resistance: Engineered to withstand extreme temperature changes without compromising material integrity.
- High Strength and Durability: Offers outstanding flexural strength and wear resistance, even in high-temperature environments.
- Wear and Corrosion Resistance: Designed for industries requiring long-lasting materials in challenging conditions such as sintering processes.
Applications
Silicon Nitride Bonded Silicon Carbide plates are ideal for:
- Kiln Furniture: Widely used in high-temperature kilns for ceramics and glass production.
- Industrial Heat Treatment: Suitable for environments where consistent strength and heat tolerance are required.
- Support Materials: Perfect for structural support in high-temperature and high-stress industrial applications.
Technical Highlights
- Thermal Expansion Control: The thermal expansion rate is 4.7 x 10⁻⁶ at 1000°C, providing stability under fluctuating temperatures.
- High Hardness: With hardness levels of 2500 Kg/mm², the plates can withstand abrasive and tough environments.
- Efficient Heat Dissipation: Thermal conductivity of 20 W/m•K at 1200°C ensures effective heat management during operations.
Technical Specifications
| Parameter | Value |
|---|---|
| SiC Content (%) | ≤75 |
| Si₃N₄ Content (%) | ≥25 |
| Thermal Expansion Rate (x10⁻⁶ at 1000°C) | 4.7 |
| Hardness at 20°C (Kg/mm²) | 2500 |
| Thermal Conductivity at 1200°C (W/m•K) | 20 |
| High Temperature Flexural Strength (1200°C•0.5h) (MPa) | 170~180 |
| Suggested Working Temperature (°C) | <1450 |
| Open Porosity (%) | <1 |
| Bulk Density (g/cm³) | 2.75~2.85 |
